A solder ball planting mesh anti-splash pad is an accessory used during BGA (Ball Grid Array) reballing and solder ball planting to keep solder balls in place and reduce scattering during the soldering process.

Description

The anti-splash pad is typically made from high-temperature silicone, fiberglass, or heat-resistant composite materials. It is placed beneath or around the solder ball planting mesh (stencil) during reballing.

Functions

• Prevents solder ball scattering: Stops loose solder balls from bouncing or rolling away while they are being spread across the mesh.
• Protects the work surface: Shields the workstation from solder flux, solder splashes, and heat.
• Improves ball placement: Provides a stable, slightly cushioned surface that helps the stencil sit flat against the BGA chip.
• Reduces contamination: Helps keep solder balls clean by minimizing contact with dust and debris.
• Withstands high temperatures: Designed to tolerate the heat used during hot-air or infrared reflow without deforming.