The SUGON 8650 is a professional hot air rework station designed for SMD desoldering, IC removal, and BGA rework. This station delivers precise temperature control from 100°C to 500°C with adjustable airflow from 20 to 150 L/min. The digital display shows set and actual temperatures, and the automatic cooling mode protects the heating element when powering down. The ergonomic handle is lightweight and features a built-in stand. The station includes 3 different nozzles for various component sizes. This is an essential tool for removing surface-mount components, repairing lifted pads, and performing BGA rework on phone motherboards.

Key Features:

• Temperature range: 100°C-500°C

• Adjustable airflow: 20-150 L/min

• Digital display with set/actual temp

• Automatic cooling mode

• 3 interchangeable nozzles included

• Ergonomic handle with stand

Use Cases: SMD desoldering, IC removal, BGA rework, heat shrink tubing, component removal