The IPX-17 Composite Stencils Set is a comprehensive collection of precision stencils covering iPhone models from iPhone X through iPhone 17. This set includes laser-cut stainless steel stencils for CPU, NAND, baseband, and other IC chips. Each stencil is precision-machined with accurate ball grid patterns for perfect solder ball placement during reballing. The composite design means multiple chip patterns are combined on single stencils, maximizing coverage while minimizing the number of stencils needed. These stencils are essential for technicians performing CPU reballing, IC replacement, and motherboard repair on iPhones. The stainless steel construction is durable and easy to clean after use.

Key Features:

• Covers iPhone X through iPhone 17

• Laser-cut stainless steel construction

• Includes CPU, NAND, and baseband stencils

• Precision ball grid patterns

• Durable and easy to clean

• Essential for iPhone motherboard repair

Use Cases: iPhone CPU reballing, IC replacement, NAND upgrade, motherboard repair