The Xiaomi Composite Stencils Set is a professional stencil kit designed for Xiaomi phone motherboard repair. This set includes precision laser-cut stainless steel stencils for CPU, power management ICs, NAND memory, and other common chips found in Xiaomi devices. Each stencil features accurate ball grid patterns for precise solder ball placement during reballing. The composite design combines multiple chip patterns on each stencil for efficient coverage. These stencils are essential for technicians performing CPU reballing, IC replacement, and board-level repair on Xiaomi smartphones.

Key Features:

• Designed for Xiaomi phones

• Laser-cut stainless steel construction

• Includes CPU, PMIC, and NAND stencils

• Precision ball grid patterns

• Durable and easy to clean

• Essential for Xiaomi motherboard repair

Use Cases: Xiaomi CPU reballing, IC replacement, NAND upgrade, motherboard repair