The RELIFE RL-007GA is a PCB solder pad repair kit designed for repairing damaged or missing solder pads on mobile phone logic boards and other small electronic circuit boards. It is commonly used in smartphone motherboard repair, especially for restoring lifted or torn pads after removing ICs or connectors.

Key Features

• Pad restoration: Replaces damaged or missing solder pads without requiring traditional jumper-wire loops.
• Multiple pad sizes: Includes approximately 1,400 copper repair pads in 10 different sizes, making it suitable for a wide range of mobile phone and PCB repairs.
• Ultra-thin copper construction: Manufactured from about 30 μm industrial-grade copper foil, allowing the repaired pad to closely match the original PCB thickness.
• Strong adhesion: Designed to bond securely to the PCB and work well with UV solder mask after installation.
• High solderability: Provides a flat, stable surface that improves soldering quality and reduces the risk of cold solder joints.

Applications

The RL-007GA is commonly used for:

• Repairing torn or lifted solder pads
• Rebuilding connector pads (battery, charging, display, etc.)
• IC pad repair after chip removal
• BGA and PCB trace restoration
• Smartphone, tablet, and other precision electronics repairs

Benefits

• Speeds up motherboard repairs compared with making jumper-wire loops.
• Produces a cleaner, more professional repair.
• Helps restore the board to a near-original appearance and electrical performance.
• Suitable for both routine repairs and advanced microsoldering work