The QU9 stencil (QU:9) is a precision reballing stencil designed for specific Qualcomm CPU models. This laser-cut stainless steel stencil features accurate ball grid patterns for perfect solder ball placement during CPU reballing. The stencil is durable, reusable, and easy to clean. This is an essential tool for technicians performing CPU reballing on Qualcomm-based Android phones.

Key Features:

• For Qualcomm QU9 series CPUs

• Laser-cut stainless steel construction

• Precision ball grid patterns

• Durable and reusable

• Easy to clean

Use Cases: Qualcomm CPU reballing, Android phone motherboard repair, IC replacement